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ICACC 2015 Presentation, Copper Clad Ultra-Thin Flexible Ceramic Substrate for High Power Electronics

by John Olenick
Thu, Jan 29th 2015 04:50 pm
Signal test circuit on copper sheathed Thin E-Strate
Signal test circuit on copper sheathed Thin E-Strate
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See presentation, click here.

See LED Diebonded and Wirebonded to Cu Sheathed Substrate.

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See the benefits of Thin E-Strate®

Advantages of Using Thin E-Strate®

Thin E-Strate® for active or passive device fabrication. More robust than silicon.

As a ceramic, 3YSZ is inert, of high purity, tolerates processing temperatures to 1200°C, and with its low thermal mass can tolerate high thermal shock during deposition or coating processes.

Being ultra thin to 20 microns thick, it presents a very low thermal resistance path for heat removal and a super thin profile for component coating.  Multi-layers of active layer coated Thin E-Strate® can easily be stacked into low profile components.

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Industry Applications of Thin E-Strate®

Thin E-Strate® redefines the world of robust flexible ultra-thin ceramic foils.  Major applications include:

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    Solar PV
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    Fuel Cells
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    Electronics
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    Gas Sensors
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    Cladding