Featured News - Current News - Archived News - News Categories

ICACC 2015 Presentation, Copper Clad Ultra-Thin Flexible Ceramic Substrate for High Power Electronics

by John Olenick
Thu, Jan 29th 2015 04:50 pm
Signal test circuit on copper sheathed Thin E-Strate
Signal test circuit on copper sheathed Thin E-Strate
No Prior Images
Viewing 1 of 2
View Next Image

See presentation, click here.

See LED Diebonded and Wirebonded to Cu Sheathed Substrate.

Upcoming Events

See the benefits of Thin E-Strate®

Advantages of Using Thin E-Strate®

Thin E-Strate® for active or passive device fabrication. More robust than silicon.

As a ceramic, 3YSZ is inert, of high purity, tolerates processing temperatures to 1200°C, and with its low thermal mass can tolerate high thermal shock during deposition or coating processes.

Being ultra thin to 20 microns thick, it presents a very low thermal resistance path for heat removal and a super thin profile for component coating.  Multi-layers of active layer coated Thin E-Strate® can easily be stacked into low profile components.

Featured Video


Industry Applications of Thin E-Strate®

Thin E-Strate® redefines the world of robust flexible ultra-thin ceramic foils.  Major applications include:

  • #
    Solar PV
  • #
    Fuel Cells
  • #
  • #
    Gas Sensors
  • #