IMAPS 2018

Mon Oct 8th, 2018 12 am to Thu Oct 11th, 2018 12 am
At Pasadena Convention Center; Pasadena, California
51st Symposium on Micro-Electronics. ENrG will exhibit, present a paper on Ribbon Ceramics, and John Olenick will teach a 2 hour course on Flexible Ceramics.

The 51st International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society (IMAPS). This year IMAPS has rolled out a new technical program that has been organized to help attendees find their key interests faster. This was done by defining 5 leading Tracks with topics centered around the major package platforms such as Wafer Level, Flip Chip, 2D/3D, SiP, as well as the traditional focus areas of reliability, advanced materials and processes. As a result, we have seen a high level of turnout in abstract submissions. This new technical structure was the result of previous attendee feedback, where they were interested in a technical program that makes it much easier to attend multiple papers in a single session vs having to search to find the key topics of interest. The Symposium will again feature our Interactive Poster Session.

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Advantages of Using Thin E-Strate®

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As a ceramic, 3YSZ is inert, of high purity, tolerates processing temperatures to 1200°C, and with its low thermal mass can tolerate high thermal shock during deposition or coating processes.

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