Thin E-Strate® overcomes the limitations of previously available substrate materials to open new doors in advancing the development of higher performance and new capability products. Technologists have had diminishing returns as the attempt to overcome the shortcomings of substrates made from silicon wafers, thin metal, glass, polyimide and aluminum oxide.
As a ceramic, 3YSZ) is inert, of high purity, and tolerates processing temperatures to 1200°C. With its low thermal mass in ultra-thin sheet format, it can tolerate high thermal shock during deposition or coating processes and in applications.
Being ultra thin, at 20-40 microns thick, it presents a very low thermal resistance path for heat removal and a super thin profile for components. Multiple layers of active coated Thin E-Strate® can be stacked for high density, high performance chemistries such as batteries. The impermeable, high density nature of Thin E-Strate® protects the integrity of those chemistries from internal and external contamination.
Thin E-Strate® ceramic is non-conductive like an insulator, and through propriety ENrG manufacturing technology is flexible like a metal thereby enabling the development of products that conform to tight curved spaces.
Thin E-Strate® overcomes limitations of other substrates.
Currently available in sheets, ENrG's product roadmap includes a roll-to-roll format (R2R) in 2016.
EMC/MRS 2015 Presentation, GaN-Based LED on Flexible Ceramic Substrate
Researchers found a 10 degree C difference in junction temperature for LEDs on Thin E-Strate vs. Polyimide, therefore higher light output....more
ICACC 2015 Presentation, R2R Ultra-Thin Flexible Ceramic Substrate for Coating Applications
John Olenick, President of ENrG Inc presented the company's plans for 2015-2016 on the development and sampling of roll-to-roll (R2R) thin flexible ceramic substrate....more
As a ceramic, 3YSZ is inert, of high purity, tolerates processing temperatures to 1200°C, and with its low thermal mass can tolerate high thermal shock during deposition or coating processes.
Being ultra thin from 40 down to 20 microns thick, it presents a very low thermal resistance path for heat removal and a super thin profile for component coating. Multi-layers of active layer coated Thin E-Strate® can easily be stacked into low profile components.